Title :
Dynamic thermal management via architectural adaptation
Author :
Jayaseelan, Ramkumar ; Mitra, Tulika
Author_Institution :
Sch. of Comput., Nat. Univ. of Singapore, Singapore, Singapore
Abstract :
Exponentially rising cooling/packaging costs due to high power density call for architectural and software level thermal management. Dynamic thermal management (DTM) techniques continuously monitor the on-chip processor temperature. Appropriate mechanisms (e.g., dynamic voltage or frequency scaling (DVFS), clock gating, fetch gating, etc.) are engaged to lower the temperature if it exceeds a threshold. However, all these mechanisms incur significant performance penalty. We argue that runtime adaptation of microarchitectural parameters, such as instruction window size and issue width, is a more effective mechanism for DTM. If the architectural parameters can be tailored to track the available instruction level parallelism of the program, the temperature is reduced with minimal performance degradation. Moreover, synergistically combining architectural adaptation with DVFS and fetch gating can achieve the best performance under thermal constraints. The key difficulty in using multiple mechanisms is to select the optimal configuration at runtime for time varying workloads. We present a novel software level thermal management framework that searches through the configuration space at regular intervals to find the best performing design point that is thermally safe. The central components of our framework are (1) a neural network based classifier that filters the thermally unsafe configurations, (2) a fast performance prediction model for any configuration, and (3) an efficient configuration space search algorithm. Experimental results indicate that our adaptive scheme achieves 59% reduction in performance overhead compared to DVFS and 39% reduction in overhead compared to DVFS combined with fetch gating.
Keywords :
neural nets; power aware computing; thermal management (packaging); architectural adaptation; architectural parameter; clock gating; dynamic thermal management; fetch gating; frequency scaling; instruction level parallelism; microarchitectural parameter; minimal performance degradation; neural network based classifier; on-chip processor temperature; packaging; performance penalty; performance prediction model; power density; software level thermal management; space search algorithm; thermal constraint; Cooling; Costs; Energy management; Monitoring; Packaging; Runtime; Software packages; Temperature; Thermal management; Threshold voltage; Architecture Adaptation; Dynamic Thermal Management;
Conference_Titel :
Design Automation Conference, 2009. DAC '09. 46th ACM/IEEE
Print_ISBN :
978-1-6055-8497-3