DocumentCode :
3598637
Title :
Investigation of Micro Stress in Adhesive Bonds in Electro Optics, and Micro Optics
Author :
Gesang, Thomas ; Zickwolf, Rolf ; Friedsam, Gerhard
Author_Institution :
Fraunhofer Inst. fur Fertigungstechnik und Angewandte Materialforschung (IFAM), Bremen
Volume :
1
fYear :
2006
Firstpage :
532
Lastpage :
539
Abstract :
Micro stress in adhesive bonds was analysed and optimised for 2 examples from electro optics, and micro optics. The investigative tools were various experiments on both, model joints and real joints, finite element modelling, and validation experiments. Micro stresses were found to influence both, manufacturing quality and ageing/reliability properties
Keywords :
adhesive bonding; ageing; electro-optical effects; finite element analysis; micro-optics; reliability; stress analysis; adhesive bonds; ageing properties; electro optics; finite element modelling; manufacturing quality; microoptics; microstress; reliability properties; Adhesives; Bonding; Boring; Diodes; Electrooptic devices; Finite element methods; Manufacturing; Optical feedback; Stress; Vertical cavity surface emitting lasers;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Systemintegration Technology Conference, 2006. 1st
Print_ISBN :
1-4244-0552-1
Electronic_ISBN :
1-4244-0553-x
Type :
conf
DOI :
10.1109/ESTC.2006.280054
Filename :
4060778
Link To Document :
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