DocumentCode
3598637
Title
Investigation of Micro Stress in Adhesive Bonds in Electro Optics, and Micro Optics
Author
Gesang, Thomas ; Zickwolf, Rolf ; Friedsam, Gerhard
Author_Institution
Fraunhofer Inst. fur Fertigungstechnik und Angewandte Materialforschung (IFAM), Bremen
Volume
1
fYear
2006
Firstpage
532
Lastpage
539
Abstract
Micro stress in adhesive bonds was analysed and optimised for 2 examples from electro optics, and micro optics. The investigative tools were various experiments on both, model joints and real joints, finite element modelling, and validation experiments. Micro stresses were found to influence both, manufacturing quality and ageing/reliability properties
Keywords
adhesive bonding; ageing; electro-optical effects; finite element analysis; micro-optics; reliability; stress analysis; adhesive bonds; ageing properties; electro optics; finite element modelling; manufacturing quality; microoptics; microstress; reliability properties; Adhesives; Bonding; Boring; Diodes; Electrooptic devices; Finite element methods; Manufacturing; Optical feedback; Stress; Vertical cavity surface emitting lasers;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Systemintegration Technology Conference, 2006. 1st
Print_ISBN
1-4244-0552-1
Electronic_ISBN
1-4244-0553-x
Type
conf
DOI
10.1109/ESTC.2006.280054
Filename
4060778
Link To Document