Title :
Reduction of micromovement in optoelectronic packaging
Author :
Cheng, W.H. ; Wang, W.H. ; Chen, H.Y. ; Lin, H.H.
Author_Institution :
Inst. of Electro-Opt. Eng., Nat. Sun Yat-Sen Univ., Kaohsiung, Taiwan
Abstract :
A reduction of micromovement in semiconductor laser packaging using a laser welding technique was presented. It was found that the micromovement and its association with the power coupling loss of laser packaging can be reduced under proper pressure constraints. Using a low pressure constraint of 10 pounds, a low-cost laser package was fabricated successfully. Preliminary reliability studies showed that these laser packages are stable and reliable. The results indicate that reduction of micromovement in semiconductor laser packaging using the laser welding technique can be used as an effective manufacturing tool for fabricating reliable and low-cost laser packages
Keywords :
laser beam welding; laser reliability; optical fabrication; semiconductor device packaging; semiconductor device reliability; semiconductor lasers; fabrication; laser welding; micromovement; optoelectronic packaging; power coupling loss; pressure constraints; reliability; semiconductor laser; Fiber lasers; Laser stability; Lasers and electrooptics; Optical coupling; Power lasers; Semiconductor device packaging; Semiconductor lasers; Temperature; Testing; Welding;
Conference_Titel :
Lasers and Electro-Optics Society Annual Meeting, 1995. 8th Annual Meeting Conference Proceedings, Volume 1., IEEE
Print_ISBN :
0-7803-2450-1
DOI :
10.1109/LEOS.1995.484855
