DocumentCode :
3598847
Title :
Testing for interconnect crosstalk defects using on-chip embedded processor cores
Author :
Chen, Li ; Bai, Xiaoliang ; Dey, Sujit
Author_Institution :
Dept. of Electr. & Comput. Eng., California Univ., San Diego, La Jolla, CA, USA
fYear :
2001
fDate :
6/23/1905 12:00:00 AM
Firstpage :
317
Lastpage :
322
Abstract :
Crosstalk effects degrade the integrity of signals traveling on long interconnects and must be addressed during production testing. External testing for crosstalk is expensive due to the need for high-speed testers. Built-in self-test, while eliminating the need for a high-speed tester, may lead to excessive test overhead as well as overly aggressive testing. To address this problem, we propose a new software-based self-test methodology for system-on-chip (SoC) devices based on embedded processors. It enables an on-chip embedded processor core to test for crosstalk in system-level interconnects by executing a self-test program in the normal operational mode of the SoC. We have demonstrated the feasibility of this method by applying it to test the interconnects of a processor-memory system. The defect coverage was evaluated using a system-level crosstalk defect simulation method.
Keywords :
application specific integrated circuits; automatic testing; crosstalk; fault simulation; integrated circuit interconnections; integrated circuit testing; microprocessor chips; SoC interconnect crosstalk defects; SoC normal operational mode; defect coverage evaluation; onchip embedded processor cores; processor-memory system; self-test program; signal integrity; software-based self-test methodology; system-level crosstalk defect simulation method; system-level interconnect testing; system-on-chip; Automatic testing; Built-in self-test; Circuit testing; Crosstalk; Delay; Hardware; Integrated circuit interconnections; Software testing; System testing; System-on-a-chip;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design Automation Conference, 2001. Proceedings
ISSN :
0738-100X
Print_ISBN :
1-58113-297-2
Type :
conf
DOI :
10.1109/DAC.2001.156158
Filename :
935527
Link To Document :
بازگشت