DocumentCode
3598908
Title
Distance learning - how to use this new didactic method in education of electronics engineering?
Author
Illyefalvi-Vit?©z, Zsolt ; Gordon, Peter
Author_Institution
Dept. of Electron. Technol., Budapest Univ. of Technol. & Econ., Hungary
Volume
2
fYear
2004
Firstpage
1725
Abstract
Distance learning (DL) is an instructional delivery system that connects learners with educational resources. In microelectronics and microsystems interconnection and packaging technology, the preparation of electronics engineers for the ever growing requirements is especially a challenge for today´s education, and there is an essential need for the application of advanced curricula and teaching methods. In the present paper, the driving forces for the development of curricula and didactic methods are outlined, followed by the detailed discussion of the needs for and the applicability of distance learning. Then, an example is provided for the application of the Internet-based performance centered instructions (IPCI) model for providing Web-based DL experiments in the special field of surface mounting technology (SMT) for students of electrical engineering and graduate engineers interested in microelectronics packaging and interconnection technology. Finally conclusions are drawn and further efforts are outlined.
Keywords
distance learning; educational aids; educational courses; electronic engineering education; electronics packaging; information resources; interconnections; surface mount technology; IPCI model; Internet-based performance centered instructions; SMT; Web-based distance learning; curricula; didactic methods; distance learning; educational resources; electrical engineering; electronics engineering education; instructional delivery system; interconnection technology; microelectronics; microsystems; packaging technology; surface mounting technology; teaching methods; Computer aided instruction; Continuing education; Educational technology; Electronics packaging; Gold; Joining processes; Knowledge engineering; Microelectronics; Surface-mount technology; Web sites;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2004. Proceedings. 54th
Print_ISBN
0-7803-8365-6
Type
conf
DOI
10.1109/ECTC.2004.1320351
Filename
1320351
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