• DocumentCode
    3598908
  • Title

    Distance learning - how to use this new didactic method in education of electronics engineering?

  • Author

    Illyefalvi-Vit?©z, Zsolt ; Gordon, Peter

  • Author_Institution
    Dept. of Electron. Technol., Budapest Univ. of Technol. & Econ., Hungary
  • Volume
    2
  • fYear
    2004
  • Firstpage
    1725
  • Abstract
    Distance learning (DL) is an instructional delivery system that connects learners with educational resources. In microelectronics and microsystems interconnection and packaging technology, the preparation of electronics engineers for the ever growing requirements is especially a challenge for today´s education, and there is an essential need for the application of advanced curricula and teaching methods. In the present paper, the driving forces for the development of curricula and didactic methods are outlined, followed by the detailed discussion of the needs for and the applicability of distance learning. Then, an example is provided for the application of the Internet-based performance centered instructions (IPCI) model for providing Web-based DL experiments in the special field of surface mounting technology (SMT) for students of electrical engineering and graduate engineers interested in microelectronics packaging and interconnection technology. Finally conclusions are drawn and further efforts are outlined.
  • Keywords
    distance learning; educational aids; educational courses; electronic engineering education; electronics packaging; information resources; interconnections; surface mount technology; IPCI model; Internet-based performance centered instructions; SMT; Web-based distance learning; curricula; didactic methods; distance learning; educational resources; electrical engineering; electronics engineering education; instructional delivery system; interconnection technology; microelectronics; microsystems; packaging technology; surface mounting technology; teaching methods; Computer aided instruction; Continuing education; Educational technology; Electronics packaging; Gold; Joining processes; Knowledge engineering; Microelectronics; Surface-mount technology; Web sites;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2004. Proceedings. 54th
  • Print_ISBN
    0-7803-8365-6
  • Type

    conf

  • DOI
    10.1109/ECTC.2004.1320351
  • Filename
    1320351