• DocumentCode
    35991
  • Title

    Fabrication of Thin Film Multijunction Thermal Converters With Improved Long-Term Stability

  • Author

    Fujiki, Hiroyuki ; Amagai, Yasutaka ; Shimizume, Koji ; Kishino, Kaname ; Hidaka, Shigeru

  • Author_Institution
    Nat. Metrol. Inst. of Japan, Nat. Inst. of Adv. Ind. Sci. & Technol., Tsukuba, Japan
  • Volume
    64
  • Issue
    6
  • fYear
    2015
  • fDate
    Jun-15
  • Firstpage
    1754
  • Lastpage
    1759
  • Abstract
    To increase the long-term stability of thin-film multijunction thermal converters (TFMJTCs) developed by the National Metrology Institute of Japan and Nikkohm Corporation Ltd., we prevented their degradation by improving the design and fabrication process. Judging from the Arrhenius model experiments, we successfully increased the lifetime of a renewed TFMJTC to more than 20 years by improving the deposition pattern of a Bi-Sb-Cu-based thin-film thermopile. We also evaluated the thermoelectric effect of the renewed TFMJTCs by the fast-reversed dc method. The low thermoelectric effect of less than 0.1 μV/V has been realized, which is comparable with that of high-quality multijunction thermal converters previously produced by other national metrology institutes.
  • Keywords
    antimony; bismuth; circuit stability; convertors; copper; thermoelectricity; thermopiles; thin film devices; Arrhenius model; Bi-Sb-Cu; National Metrology Institute of Japan; Nikkohm Corporation Ltd.; TFMJTC; deposition pattern; fast-reversed DC method; long-term stability; thermoelectric effect; thin film multijunction thermal converter fabrication; thin-film thermopile; Electrical resistance measurement; Heating; Resistance; Standards; Temperature; Temperature measurement; Thermal stability; AC voltage standard; ac-dc transfer difference; ac???dc transfer difference; long-term stability; thermal converter; thermocouple; thin film; thin film.;
  • fLanguage
    English
  • Journal_Title
    Instrumentation and Measurement, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9456
  • Type

    jour

  • DOI
    10.1109/TIM.2015.2389371
  • Filename
    7021922