DocumentCode
35991
Title
Fabrication of Thin Film Multijunction Thermal Converters With Improved Long-Term Stability
Author
Fujiki, Hiroyuki ; Amagai, Yasutaka ; Shimizume, Koji ; Kishino, Kaname ; Hidaka, Shigeru
Author_Institution
Nat. Metrol. Inst. of Japan, Nat. Inst. of Adv. Ind. Sci. & Technol., Tsukuba, Japan
Volume
64
Issue
6
fYear
2015
fDate
Jun-15
Firstpage
1754
Lastpage
1759
Abstract
To increase the long-term stability of thin-film multijunction thermal converters (TFMJTCs) developed by the National Metrology Institute of Japan and Nikkohm Corporation Ltd., we prevented their degradation by improving the design and fabrication process. Judging from the Arrhenius model experiments, we successfully increased the lifetime of a renewed TFMJTC to more than 20 years by improving the deposition pattern of a Bi-Sb-Cu-based thin-film thermopile. We also evaluated the thermoelectric effect of the renewed TFMJTCs by the fast-reversed dc method. The low thermoelectric effect of less than 0.1 μV/V has been realized, which is comparable with that of high-quality multijunction thermal converters previously produced by other national metrology institutes.
Keywords
antimony; bismuth; circuit stability; convertors; copper; thermoelectricity; thermopiles; thin film devices; Arrhenius model; Bi-Sb-Cu; National Metrology Institute of Japan; Nikkohm Corporation Ltd.; TFMJTC; deposition pattern; fast-reversed DC method; long-term stability; thermoelectric effect; thin film multijunction thermal converter fabrication; thin-film thermopile; Electrical resistance measurement; Heating; Resistance; Standards; Temperature; Temperature measurement; Thermal stability; AC voltage standard; ac-dc transfer difference; ac???dc transfer difference; long-term stability; thermal converter; thermocouple; thin film; thin film.;
fLanguage
English
Journal_Title
Instrumentation and Measurement, IEEE Transactions on
Publisher
ieee
ISSN
0018-9456
Type
jour
DOI
10.1109/TIM.2015.2389371
Filename
7021922
Link To Document