DocumentCode
36000
Title
Highly Integrated C-Band GaN High Power Amplifier MMIC for Phased Array Applications
Author
Youn Sub Noh ; In Bok Yom
Author_Institution
Broadcasting & Telecommun. Media Res. Lab., Electron. & Telecommun. Res. Inst. (ETRI), Daejeon, South Korea
Volume
25
Issue
6
fYear
2015
fDate
Jun-15
Firstpage
406
Lastpage
408
Abstract
A C-band high-power and high power added efficiency (PAE) high power amplifier (HPA) monolithic microwave integrated circuit (MMIC) fabricated by using 0.25 μm gallium nitride (GaN) high electron mobility transistor (HEMT) technology has been developed for phased array antennas. The MMIC operates in pulse conditions of 100 μs pulse width and 10% of duty cycle over the frequency from 5.2 to 6.8 GHz. The MMIC exhibits an output power of 45.7 dBm to 46.4 dBm and a power added efficiency (PAE) of 51.5% to 56.5% under a drain voltage of 30 V. The MMIC size is as small as 12.54 mm2, generating an output power density up to 3.48 W/mm2 over the chip area and up to 4.55 W/mm over the active periphery.
Keywords
III-V semiconductors; MMIC power amplifiers; antenna phased arrays; gallium compounds; high electron mobility transistors; wide band gap semiconductors; GaN; HEMT technology; HPA; MMIC; PAE; drain voltage; duty cycle; efficiency 51.5 percent to 56.5 percent; frequency 5.2 GHz to 6.8 GHz; high electron mobility transistor; highly integrated C-band gallium nitride high power amplifier; monolithic microwave integrated circuit; phased array antenna application; power added efficiency; power density; pulse condition; pulse width; size 0.25 mum; voltage 30 V; Frequency measurement; Gallium nitride; HEMTs; MMICs; Power generation; Temperature measurement; Voltage measurement; C-band; high electron mobility transistor (HEMT); high power amplifier (HPA); monolithic microwave integrated circuit (MMIC);
fLanguage
English
Journal_Title
Microwave and Wireless Components Letters, IEEE
Publisher
ieee
ISSN
1531-1309
Type
jour
DOI
10.1109/LMWC.2015.2421316
Filename
7091042
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