DocumentCode :
3600586
Title :
Design and Optimization of a Horizontally Partitioned, High-Speed, 3D Tree-Based FPGA
Author :
Pangracious, Vinod ; Marrakchi, Zied ; Mehrez, Habib
Volume :
35
Issue :
6
fYear :
2015
Firstpage :
48
Lastpage :
59
Abstract :
The authors explore and design the traditional field-programmable gate array (FPGA) interconnect topologies and architectures that can play an important role in improving performance and density. The main architectures under exploration are tree-based and island-style Manhattan Mesh. Mesh-based design is the most common industrial and academic architecture. Numerous research and industrial designs have been developed to improve mesh-based FPGAs´ performance, area, and power consumption. Nonetheless, when looking at performance metrics such as speed, area, and power, the gap is generally very wide for FPGAs compared to application-specific integrated circuits (ASICs). Despite their good properties, such as high logic density and area advantage, tree-based architectures have been overlooked up to now. This article addresses long wire length issues associated with tree-based programmable interconnects using 3D design and manufacturing technologies. Using their dedicated 3D design and optimization methodology, the authors show that 3D tree-based architecture is 1.5 times faster than the mesh-based counterpart.
Keywords :
field programmable gate arrays; integrated circuit interconnections; three-dimensional integrated circuits; trees (mathematics); 3D design technology; 3D manufacturing technology; density improvement; field-programmable gate array architectures; field-programmable gate array interconnect topologies; horizontally partitioned-high-speed-3D tree-based FPGA design; horizontally partitioned-high-speed-3D tree-based FPGA optimization; island-style Manhattan mesh; performance improvement; performance metrics; tree-based mesh; tree-based programmable interconnects; wire length; Computer architecture; Delays; Field programmable gate arrays; Integrated circuit interconnections; Routing; Three-dimensional displays; Through-silicon vias; 3D integration; BFT; FPGA; TSV; butterfly fat tree; field-programmable gate array; mesh; through silicon via; tree-based FPGA;
fLanguage :
English
Journal_Title :
Micro, IEEE
Publisher :
ieee
ISSN :
0272-1732
Type :
jour
DOI :
10.1109/MM.2014.57
Filename :
6866846
Link To Document :
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