• DocumentCode
    3600688
  • Title

    T-VEMA: A Temperature- and Variation-Aware Electromigration Power Grid Analysis Tool

  • Author

    Di-An Li ; Marek-Sadowska, Malgorzata ; Nassif, Sani R.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of California at Santa Barbara, Santa Barbara, CA, USA
  • Volume
    23
  • Issue
    10
  • fYear
    2015
  • Firstpage
    2327
  • Lastpage
    2331
  • Abstract
    In this brief, a temperature- and variation-aware electromigration analysis (T-VEMA) tool for power grid wires is described. First, T-VEMA performs a two-stage interconnect thermal analysis on a full chip. Next, the tool extracts the effective jL product values and performs an electromigration (EM) lifetime calculation on ideally manufactured mortal wires on the basis of thermal effects. Finally, T-VEMA analyzes process variation effects on EM reliability at global and local levels and reports variation tolerances of EM-sensitive power grid wires.
  • Keywords
    electromigration; integrated circuit interconnections; integrated circuit reliability; power grids; thermal analysis; EM reliability; EM-sensitive power grid wires; T-VEMA; power grid analysis tool; temperature-aware electromigration; thermal effects; two-stage interconnect thermal analysis; variation-aware electromigration; Computational modeling; Current density; Integrated circuit interconnections; Integrated circuit modeling; Power grids; Thermal analysis; Wires; Electromigration (EM); jL product; process variation; thermal analysis;
  • fLanguage
    English
  • Journal_Title
    Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1063-8210
  • Type

    jour

  • DOI
    10.1109/TVLSI.2014.2358678
  • Filename
    6918511