DocumentCode :
3600688
Title :
T-VEMA: A Temperature- and Variation-Aware Electromigration Power Grid Analysis Tool
Author :
Di-An Li ; Marek-Sadowska, Malgorzata ; Nassif, Sani R.
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of California at Santa Barbara, Santa Barbara, CA, USA
Volume :
23
Issue :
10
fYear :
2015
Firstpage :
2327
Lastpage :
2331
Abstract :
In this brief, a temperature- and variation-aware electromigration analysis (T-VEMA) tool for power grid wires is described. First, T-VEMA performs a two-stage interconnect thermal analysis on a full chip. Next, the tool extracts the effective jL product values and performs an electromigration (EM) lifetime calculation on ideally manufactured mortal wires on the basis of thermal effects. Finally, T-VEMA analyzes process variation effects on EM reliability at global and local levels and reports variation tolerances of EM-sensitive power grid wires.
Keywords :
electromigration; integrated circuit interconnections; integrated circuit reliability; power grids; thermal analysis; EM reliability; EM-sensitive power grid wires; T-VEMA; power grid analysis tool; temperature-aware electromigration; thermal effects; two-stage interconnect thermal analysis; variation-aware electromigration; Computational modeling; Current density; Integrated circuit interconnections; Integrated circuit modeling; Power grids; Thermal analysis; Wires; Electromigration (EM); jL product; process variation; thermal analysis;
fLanguage :
English
Journal_Title :
Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
Publisher :
ieee
ISSN :
1063-8210
Type :
jour
DOI :
10.1109/TVLSI.2014.2358678
Filename :
6918511
Link To Document :
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