• DocumentCode
    3600712
  • Title

    Thermal-Constrained Task Scheduling on 3-D Multicore Processors for Throughput-and-Energy Optimization

  • Author

    Chien-Hui Liao ; Wen, Charles H.-P

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Nat. Chaio Tung Univ., Hsinchu, Taiwan
  • Volume
    23
  • Issue
    11
  • fYear
    2015
  • Firstpage
    2719
  • Lastpage
    2723
  • Abstract
    Thermal-constrained task scheduler for throughput optimization on 3-D multicore processors (3-D MCPs) has been studied extensively. However, these throughput-optimized strategies often ignore energy consumption and overuse thermal simulations. Therefore, in this brief, a new strategy named thermal-aware mapping and VoltagE scaling (TAMVES) is proposed to optimize throughput and energy consumption while satisfying thermal constraints (in terms of both peak temperature and temperature gradient) simultaneously. Layer-by-layer task-to-core mapping and thermal-and-energy-aware voltage scaling are incorporated in TAMVES to reduce peak temperature and temperature gradient without extensive thermal simulation. Furthermore, idle time slots are also utilized by voltage scaling for minimizing energy consumption. Our experimental results show that under thermal constraints, TAMVES outperforms a previous work (3-D Wave) by 35.30% averagely on throughput. In addition, TAMVES that features three-order faster speed under timing constraints outperforms 3-D Wave for saving 51.17% more energy and reducing 8.37% more peak temperature and 5.67% more temperature gradient. As a result, TAMVES has proven itself an effective task scheduler that optimizes throughput and energy on 3-D MCPs under thermal constraints.
  • Keywords
    multiprocessing systems; power aware computing; scheduling; 3-D multicore processors; TAMVES; energy consumption reduction; layer-by-layer task-to-core mapping; peak temperature; temperature gradient; thermal constraints; thermal-and-energy-aware voltage scaling; thermal-aware mapping and voltage scaling; thermal-constrained task scheduling; throughput-and-energy optimization; Energy consumption; Heat sinks; Multicore processing; Power demand; Program processors; Throughput; Very large scale integration; 3-D multicore processor (3-D MCP); dynamic voltage and frequency scaling (DVFS); energy; hot spot; task scheduling; temperature gradient; throughput; throughput.;
  • fLanguage
    English
  • Journal_Title
    Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1063-8210
  • Type

    jour

  • DOI
    10.1109/TVLSI.2014.2360802
  • Filename
    6923489