DocumentCode
3600751
Title
FDR 2.0: A Low-Power Dynamically Reconfigurable Architecture and Its FinFET Implementation
Author
Ting-Jung Lin ; Wei Zhang ; Jha, Niraj K.
Author_Institution
Dept. of Electr. Eng., Princeton Univ., Princeton, NJ, USA
Volume
23
Issue
10
fYear
2015
Firstpage
1987
Lastpage
2000
Abstract
Large area/delay/power overheads are required to support the reconfigurability of field-programmable gate arrays (FPGAs). We proposed a hybrid CMOS/nanotechnology dynamically reconfigurable architecture, called NATURE, earlier to address this challenge. It uses the concept of temporal logic folding and fine-grain (i.e., cycle-level) dynamic reconfiguration to increase logic density and save area. Because logic folding reduces area significantly, most of the on-chip communications become localized. To take full advantage of localized communications, we then presented a new CMOS-based fine-grain dynamically reconfigurable (FDR) architecture. It consists of an array of homogeneous logic elements (LEs), which can be configured into logic or interconnect or a combination of both. FDR eliminates most of the long-distance and global wires, which occupy a large amount of area in conventional FPGAs. FDR improves the area-delay product by an order of magnitude relative to conventional architectures. In this paper, we present an augmented FDR 2.0 architecture, where: 1) the LE is augmented with dedicated carry logic to facilitate arithmetic operations; 2) diagonal direct links are incorporated to improve the flexibility of local communication; and 3) coarse-grain blocks, including embedded memories and digital signal processing (DSP) blocks, are added to support fast data-intensive computations. Experimental results show that the coarse-grain design can improve circuit performance by 3.6× compared with the fine-grain FDR architecture. Incorporation of the DSP blocks in FDR 2.0 also enables more effective area-delay and power-delay tradeoffs, allowing the users to trade performance for smaller area or power consumption. We have implemented the design in the 22-nm FinFET technology, which enables more flexible and effective power management. Finally, different types of FinFETs and power management techniques have been explored in FDR 2.0 to optimize power.
Keywords
CMOS logic circuits; MOSFET; carry logic; field programmable gate arrays; logic design; CMOS-based fine-grain dynamically reconfigurable architecture; FPGA; FinFET; arithmetic operations; coarse-grain blocks; dedicated carry logic; diagonal direct links; digital signal processing blocks; embedded memories; field-programmable gate arrays; homogeneous logic elements; low-power dynamically reconfigurable architecture; power management techniques; Delays; FinFETs; Integrated circuit interconnections; Logic gates; Routing; Table lookup; Dynamic reconfiguration; field-programmable gate arrays; integrated circuits; logic folding; logic folding.;
fLanguage
English
Journal_Title
Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
Publisher
ieee
ISSN
1063-8210
Type
jour
DOI
10.1109/TVLSI.2014.2360067
Filename
6939705
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