• DocumentCode
    3601452
  • Title

    High-Aspect-Ratio Metal Microfabrication by Nickel Electroplating of Patterned Carbon Nanotube Forests

  • Author

    Barrett, Lawrence K. ; Barton, Dallin J. ; Noyce, Steven G. ; Allred, David D. ; Vanfleet, Richard R. ; Davis, Robert C.

  • Author_Institution
    Dept. of Phys. & Astron., Brigham Young Univ., Provo, UT, USA
  • Volume
    24
  • Issue
    5
  • fYear
    2015
  • Firstpage
    1331
  • Lastpage
    1337
  • Abstract
    High-aspect-ratio metallic microstructures have a variety of potential applications in sensing and actuation. However, fabrication remains a challenge. We have fabricated nickel microstructures with over 20:1 aspect ratios by electroplating patterned carbon-coated carbon-nanotube forests using a nickel chloride bath. Pulse plating allows nickel ions to diffuse into the interior of the forest during off portions of the cycle. Done properly, this solves the problem of the formation of an external crust, which otherwise blocks nickel deposition in the interior of the structures. Thus, densities of 86 ± 3% of bulk Ni for the composite structures are achieved. Cantilever structures do not yield under load, but break. Measurements of the material properties of this composite material indicate an elastic modulus of ~ 42 GPa and a strength of 400 MPa. We demonstrate the utility of this method with an external field magnetic actuator consisting of a proof mass and two flexures. We achieved 1-mN actuation forces.
  • Keywords
    carbon nanotubes; composite materials; electroplating; microfabrication; nickel; Ni; cantilever structures; composite material; composite structures; elastic modulus; external field magnetic actuator; high-aspect-ratio metal microfabrication; nickel chloride bath; nickel electroplating; patterned carbon nanotube forests; pulse plating; Actuators; Carbon; Force; Magnetomechanical effects; Materials; Nickel; Magnetic; aspect ratio; aspect ratio.; carbon; microelectromechanical; nickel;
  • fLanguage
    English
  • Journal_Title
    Microelectromechanical Systems, Journal of
  • Publisher
    ieee
  • ISSN
    1057-7157
  • Type

    jour

  • DOI
    10.1109/JMEMS.2015.2395954
  • Filename
    7051208