Title :
Efficient FinFET Device Model Implementation for SPICE Simulation
Author :
Korobkov, Alexander ; Agarwal, Amit ; Venkateswaran, Subramanian
Author_Institution :
Oracle Corp., Santa Clara, CA, USA
Abstract :
With the steady growth of chip complexity and shrinking feature size, multiple challenges are emerging for transistor level circuit simulation. Compact SPICE models are a fundamental part of circuit verification, serving as a bridge between the semiconductor design and foundry. It is also an integral part of SPICE simulators, which directly affects tool performance and therefore design schedule. While the advanced 3-D technology nodes deliver superior level of scalability, simulation cost is rapidly increasing due to the computational complexity introduced by device model equations and the number of iterations required for numerical methods. In this paper, an efficient solution is proposed to reduce the computational cost associated with UC Berkeley BSIM-CMG device model evaluation, by applying robust Verilog compiler and computer algebra techniques to the device model equations. As a result of this implementation, simulation time reduction is up to 72% for complex blocks of the latest generation processor design.
Keywords :
MOSFET; SPICE; algebra; computational complexity; hardware description languages; semiconductor device models; 3D technology nodes; FinFET device model implementation; SPICE simulation; UC Berkeley BSIM-CMG device model evaluation; chip complexity; circuit verification; complex blocks; computational complexity; computer algebra; generation processor design; robust Verilog compiler; shrinking feature size; transistor level circuit simulation; Computational modeling; FinFETs; Hardware design languages; Integrated circuit modeling; Mathematical model; Performance evaluation; Semiconductor device modeling; Circuit Simulation; Circuit simulation; FinFET; MOSFET; Model Compiler; Optimization; Verilog-AMS; model compiler; optimization;
Journal_Title :
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
DOI :
10.1109/TCAD.2015.2424956