DocumentCode
3602223
Title
Isometric Test Data Compression
Author
Kumar, Amit ; Kassab, Mark ; Moghaddam, Elham ; Mukherjee, Nilanjan ; Rajski, Janusz ; Reddy, Sudhakar M. ; Tyszer, Jerzy ; Chen Wang
Author_Institution
Synopsys, Inc., Mountain View, CA, USA
Volume
34
Issue
11
fYear
2015
Firstpage
1847
Lastpage
1859
Abstract
This paper introduces a novel test data compression scheme, which is primarily devised for low-power test applications. It is based on a fundamental observation that in addition to low test cube fill rates, a very few specified bits, necessary to detect a fault, are actually irreplaceable, whereas the remaining ones can be placed in alternative locations (scan cells). The former assignments are used to create residual test cubes and, subsequently, test templates. They control a power-aware decompressor and guide automatic test pattern generation to produce highly compressible test patterns through finding alternative assignments. The proposed approach reduces, in a user-controlled manner, scan shift-in switching rates with minimal hardware modifications. It also elevates compression ratios to values typically unachievable through conventional low-power reseeding-based solutions. Experimental results obtained for large industrial designs illustrate feasibility of the proposed test scheme and are reported herein.
Keywords
automatic test pattern generation; design for testability; fault diagnosis; low-power electronics; automatic test pattern generation; fault detection; former assignments; highly compressible test patterns; isometric test data compression; low-power test applications; power-aware decompressor; residual test cubes; scan shift-in switching rates; test templates; Automatic test pattern generation; Circuit faults; Encoding; Logic gates; Switches; System-on-chip; Test data compression; Design for testability; embedded deterministic test; embedded deterministic test (EDT); low power test; low-power test; scan-based designs; test compression;
fLanguage
English
Journal_Title
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
Publisher
ieee
ISSN
0278-0070
Type
jour
DOI
10.1109/TCAD.2015.2432133
Filename
7105898
Link To Document