Title :
A Portable Dynamic Switching Model for Perpendicular Magnetic Tunnel Junctions Considering Both Thermal and Process Variations
Author :
Chen, B.J. ; Cai, K. ; Han, G.C. ; Lim, S.T. ; Tran, M.
Author_Institution :
Data Storage Inst., Agency for Sci., Technol. & Res., Singapore, Singapore
Abstract :
In this paper, we develop a portable dynamic switching model for perpendicular magnetic tunnel junctions (MTJs) considering both thermal fluctuation and process variations. The model uses macro-spin approximations where the free layer (FL) of MTJ is assumed to be in a single-domain structure. The model can generate dynamic switching transience curves at different current densities and simulate the switching successful rates for the given pulse lengths at different current densities. We also use the model to study the impact of temperature and device process variations on the switching performance, such as switching time variations. It is shown that the temperature effect is not significant when the switching current is relatively larger, and hence the spin current effect is strong enough to overtake the temperature effect. As for the process variations, it is shown that the FL thickness has a more significant effect on the switching time than the size of the FL does.
Keywords :
current density; interface magnetism; magnetic switching; magnetic tunnelling; current densities; device process variation; dynamic switching transience curves; free layer thickness; macrospin approximations; perpendicular magnetic tunnel junctions; portable dynamic switching model; pulse lengths; single-domain structure; spin current effect; switching current; switching time variations; temperature effect; temperature variation; thermal fluctuation; Fluctuations; Junctions; Magnetic tunneling; Magnetization; Mathematical model; Switches; Torque; Perpendicular magnetic tunnel junctions; Perpendicular magnetic tunnel junctions (MTJs); portable model; process variations; thermal fluctuation;
Journal_Title :
Magnetics, IEEE Transactions on
DOI :
10.1109/TMAG.2015.2436389