Title :
Effect of Carbon Overcoat Implantation on the Magnetic and Structural Properties of Perpendicular Recording Media
Author :
Piramanayagam, S.N. ; Shakerzadeh, M. ; Varghese, B. ; Tan, H.K.
Author_Institution :
Data Storage Inst., Agency for Sci., Technol. & Res., Singapore, Singapore
Abstract :
Carbon overcoats play an important role in the corrosion protection of recording media used in hard disk drive technology. Filtered-cathodic vacuum arc (FCVA) has been studied in the past as a potential technology for depositing media overcoat. In order to achieve the desired property of FCVA carbon, it is essential to apply a suitable bias voltage, which results in an energetic carbon deposition on the magnetic layer of the recording media. In this paper, we focus our attention on the implantation effects of the energetic carbon on the magnetic and the structural properties of the recording media of two types, antiferromagnetically coupled and a single layer, in order to gain a meaningful insight on the implantation and its effect. The studies reveal that the energetic deposition alters the anisotropy constant of the magnetic layer, resulting in a reduction in the coercivity and the thermal stability factor.
Keywords :
carbon; coercive force; corrosion protection; disc drives; hard discs; perpendicular magnetic anisotropy; perpendicular magnetic recording; vacuum arcs; C; FCVA carbon; anisotropy constant; antiferromagnetic couple; bias voltage; carbon overcoat implantation; coercivity reduction; corrosion protection; energetic carbon deposition; energetic deposition; filtered-cathodic vacuum arc carbon; hard disk drive technology; magnetic layer; magnetic properties; perpendicular recording media; structural properties; thermal stability factor; Carbon; Frequency control; Magnetic hysteresis; Magnetic recording; Media; Perpendicular magnetic anisotropy; Areal density; areal density; carbon overcoat; carbon overcoat (COC); implantation; magnetic anisotropy; magnetic recording; recording media;
Journal_Title :
Magnetics, IEEE Transactions on
DOI :
10.1109/TMAG.2015.2446521