DocumentCode :
3603315
Title :
Microscopic Mechanism and Experiment Research of Electromagnetically Induced Acoustic Emission
Author :
Zhichao Cai ; Suzhen Liu ; Chuang Zhang ; Qingxin Yang
Author_Institution :
Province-Minist. Joint Key Lab. of Electromagn. Field & Electr. Apparatus Reliability, Hebei Univ. of Technol., Tianjin, China
Volume :
51
Issue :
11
fYear :
2015
Firstpage :
1
Lastpage :
4
Abstract :
Based on the electrical activated plastic concept and mobile dislocation model, the mechanism of electromagnetically induced acoustic emission (EMAE) will be studied at a microscopic level. From the perspective of driving effect between electrons and dislocation, a new formulation and numerical calculation for the determination of AE radiation energy in electromagnetic loading will be derived to address the acoustic effect on the crack tip of metals. The EMAE experiments under different exciting conditions are carried out. According to dislocation kinetics theory and plastic AE theory, the mechanism and characteristics of the EMAE have a deeper analysis with experimental AE signals, validating the feasibility of the theoretical prediction of the foundation and demonstrating its superior features and value.
Keywords :
acoustic emission; cracks; dislocations; numerical analysis; plasticity; AE radiation energy determination; AE signals; EMAE; dislocation kinetics theory; electrical activated plastic; electromagnetic loading; electromagnetically induced acoustic emission; metal crack tip; microscopic mechanism; mobile dislocation model; numerical calculation; plastic AE theory; Electromagnetics; Force; Loading; Magnetic fields; Mobile communication; Plastics; Stress; Electromagnetically induced acoustic emission (EMAE); Electromagnetically induced acoustic emission(EMAE),; exciting characteristics; metal plate crack assessment; mobile dislocation;
fLanguage :
English
Journal_Title :
Magnetics, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9464
Type :
jour
DOI :
10.1109/TMAG.2015.2448938
Filename :
7131557
Link To Document :
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