Integrating and Interfacing Flexible Electronics in Hybrid Large-Area Systems

Author

Rieutort-Louis, Warren S. A. ; Sanz-Robinson, Josue ; Moy, Tiffany ; Liechao Huang ; Yingzhe Hu ; Afsar, Yasmin ; Sturm, James C. ; Verma, Naveen ; Wagner, Sigurd

Author_Institution

Dept. of Electr. Eng., Princeton Univ., Princeton, NJ, USA

Volume

5

Issue

9

fYear

2015

Firstpage

1219

Lastpage

1229

Abstract

An approach to creating large-area systems is described that combines flexible thin-film electronic sensor surfaces with complementary metal-oxide-semi-conductor (CMOS) integrated circuits (ICs). Complete systems are built by lamination of multiple layers, consisting of thin-film subsystems and CMOS ICs on a passive flexible substrate. A flexible passive backplane provides in-plane interconnections. Via-type interconnections between stacked layers are made by inductive or capacitive coupling. Steps and testing techniques, from devices and circuits to fully integrated hybrid systems, are illustrated.

Keywords

CMOS integrated circuits; flexible electronics; integrated circuit interconnections; CMOS IC; capacitive coupling; complementary metal-oxide-semi-conductor integrated circuits; flexible passive backplane; flexible thin-film electronic sensor surfaces; in-plane interconnections; inductive coupling; lamination; large-area systems; passive flexible substrate; stacked layers; thin-film subsystems; via-type interconnections; Backplanes; CMOS integrated circuits; Capacitors; Copper; Couplings; Inductors; Substrates; Flexible electronics; integration; noncontact; systems; thin film; wireless; wireless.;

fLanguage

English

Journal_Title

Components, Packaging and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

2156-3950

Type

jour

DOI

10.1109/TCPMT.2015.2448755

Filename

7163342