Wafer-Level Vacuum-Encapsulated Lamé Mode Resonator With f-Q Product of Hz

We present a wafer-level vacuum-encapsulated silicon resonator fabricated in MEMS Integrated Design for Inertial Sensors, a commercial pure-play MEMS process, recently introduced by Teledyne DALSA Semiconductor Inc. Our prototype Lamé mode encapsulated in an ultra-clean 10-mtorr vacuum cavity, achieved a quality factor of 3.24 million at a resonance frequency of 6.89 MHz, resulting in the highest recorded f-Q product of 2.23 × 10¹³ Hz for wafer-level vacuum-encapsulated silicon resonators fabricated in a commercial MEMS process.