RF Interconnections for Paper Electronics

Author

Li Xie ; Yi Feng ; Geng Yang ; Qiang Chen ; Li-Rong Zheng

Author_Institution

Sch. of Inf. & Commun. Technol., iPack Vinn Excellence Center, R. Inst. of Technol. (KTH), Kista, Sweden

Volume

25

Issue

10

fYear

2015

Firstpage

684

Lastpage

686

Abstract

Low temperature and the fragility features of paper substrate require novel approach for the heterogeneous integration of silicon chip and printed components. In this letter, RF interconnection via capacitive coupling is proposed for printed paper electronics. Capacitive coupling combined with the printed transmission line is used as the signal channel and realizes chip-to-chip communication. Modulation such as orthogonal frequency-division multiplexing is used for multiple chips to share the same transmission channel and increase the data rate. The channel response of the RF interconnection is studied and the feasibility is evaluated.

Keywords

radiofrequency interconnections; RF interconnections; capacitive coupling; channel response; chip-to-chip communication; orthogonal frequency-division multiplexing; paper substrate; printed paper electronics; printed transmission line; signal channel; transmission channel; Attenuation; Coplanar waveguides; Integrated circuit interconnections; Organic electronics; Radio frequency; Substrates; Transmission line measurements; Capacitive coupling; RF interconnection; inkjet printing; paper electronics;

fLanguage

English

Journal_Title

Microwave and Wireless Components Letters, IEEE

Publisher

ieee

ISSN

1531-1309

Type

jour

DOI

10.1109/LMWC.2015.2468572

Filename

7217854