DocumentCode :
3604932
Title :
Impact Ionization Coefficients in 4H-SiC Toward Ultrahigh-Voltage Power Devices
Author :
Niwa, Hiroki ; Suda, Jun ; Kimoto, Tsunenobu
Author_Institution :
Dept. of Electron. Sci. & Eng., Kyoto Univ., Kyoto, Japan
Volume :
62
Issue :
10
fYear :
2015
Firstpage :
3326
Lastpage :
3333
Abstract :
A temperature dependence of impact ionization coefficients in 4H-SiC was studied in a wide range of electric field toward the accurate designing of ultrahigh-voltage devices. The photomultiplication measurement was conducted for various photodiodes with different multiplication layer structures to obtain multiplication factors and ionization coefficients in a wide range of electric field strength. Especially, using multiplication layer structure with low doping concentration, the hole impact ionization coefficient was extracted at low electric field of 1 MV/cm. In high-temperature measurement, the hole ionization coefficient decreased with the increase of temperature, as observed in other semiconductor materials. For the electron ionization coefficient, however, its temperature dependence was very small and values obtained at room temperature could be used, at least up to 150 °C.
Keywords :
avalanche breakdown; electron impact ionisation; impact ionisation; photodiodes; power semiconductor devices; semiconductor doping; silicon compounds; wide band gap semiconductors; SiC; electron ionization coefficient; high-temperature measurement; hole impact ionization coefficient; impact ionization coefficients; low doping concentration; multiplication factors; multiplication layer structures; photodiodes; photomultiplication measurement; temperature dependence; ultrahigh-voltage power devices; Doping; Impact ionization; Manganese; Semiconductor device measurement; Substrates; Temperature measurement; Avalanche breakdown; device simulation; impact ionization coefficient; photodiode (PD); silicon carbide (SiC); silicon carbide (SiC).;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2015.2466445
Filename :
7222417
Link To Document :
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