DocumentCode :
3605193
Title :
Antenna-Coupled MOSFET Bolometers for Uncooled THz Sensing
Author :
Corcos, Dan ; Kaminski, Noam ; Shumaker, Evgeny ; Markish, Ofer ; Elad, Danny ; Morf, Thomas ; Drechsler, Ute ; Silatsa Saha, Winnie Tatiana ; Kull, Lukas ; Wood, Ken ; Pfeiffer, Ullrich R. ; Grzyb, Janusz
Author_Institution :
Haifa Univ. Campus, IBM Res. - Haifa, Haifa, Israel
Volume :
5
Issue :
6
fYear :
2015
Firstpage :
902
Lastpage :
913
Abstract :
In this paper, we present a comprehensive study on the operation of an antenna-coupled THz bolometer based on a micro-machined SOI-CMOS thermal sensor. The pixels are designed to operate at room temperature in vacuum. We focus on a new planar skirt antenna, which combines high sensitivity within a 0.6-1.2 THz band and 30 ° HPBW. We present an overview of the design considerations, as well as the characterization results which were obtained with both broadband and CW THz sources. The NEP of the pixel is of the order of 25 pW/Hz 1/2, with responsivity 100 mA/W at the optimal operating point. The peak responsivity to a broadband THz signal is 600 mA/W. The ease of integration with a read-out circuit and the low power dissipation make this type of pixel a good candidate for focal plane array architecture.
Keywords :
CMOS integrated circuits; MOSFET; bolometers; broadband antennas; focal planes; micromachining; planar antenna arrays; readout electronics; silicon-on-insulator; submillimetre wave antennas; terahertz wave detectors; terahertz wave imaging; CW THz source; HPBW; NEP; antenna-coupled MOSFET bolometer; broadband THz signal; focal plane array architecture; frequency 0.2 THz to 1.6 THz; micromachined SOI-CMOS thermal sensor; peak responsivity; planar skirt antenna; power dissipation; read-out circuit; uncooled THz sensing; Antennas; Bandwidth; Bolometers; Couplings; Lenses; Noise; Temperature sensors; Antenna-coupled bolometers; micromachined sensors; silicon-on-insulator; terahertz (THz) imaging; uncooled sensors;
fLanguage :
English
Journal_Title :
Terahertz Science and Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
2156-342X
Type :
jour
DOI :
10.1109/TTHZ.2015.2466470
Filename :
7230309
Link To Document :
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