Title :
Performance Evaluation of Novel Strain-Engineered Ge-InGaAs Heterojunction Tunnel Field-Effect Transistors
Author :
Jheng-Sin Liu ; Clavel, Michael B. ; Hudait, Mantu K.
Author_Institution :
Dept. of Electr. & Comput. Eng., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA
Abstract :
Novel strain-engineered staggered gap Ge/InxGa1-xAs heterojunction tunnel FETs (H-TFETs) are proposed and theoretically evaluated. Modulation of the indium alloy composition at the source-channel heterointerface resulted in 18.6× and 16.9× enhancement in ION for n- and p-channel Ge/InxGa1-xAs H-TFETs, respectively, as compared with strained Ge homojunction TFETs (p+-Ge/i-Ge/n+-Ge). The n-type H-TFETs (p+-Ge/i-InxGa1-xAs/n+-InxGa1-xAs) exhibited superior leakage suppression due to a larger tunneling barrier at the channel-drain interface. Moreover, the p-type H-TFETs (n+-InxGa1-xAs/i-Ge/p+-Ge) demonstrated a significant enhancement in ION due to an unequal shift in the conduction band edge as a result of doping-induced bandgap narrowing. The simulated tensile-strained Ge/InxGa1-xAs H-TFETs show a great promise for ultralow-power switches with high ON-state and low OFF-state current, providing a new path for low-power complimentary TFET logic.
Keywords :
III-V semiconductors; gallium arsenide; germanium; high electron mobility transistors; indium compounds; semiconductor doping; tunnel transistors; Ge-InxGa1-xAs-InxGa1-xAs; InxGa1-xAs-Ge-Ge; channel-drain interface; doping-induced bandgap narrowing; indium alloy composition; n-channel H-TFET; p-channel H-TFET; performance evaluation; source-channel heterointerface; strain-engineered Ge-InGaAs heterojunction tunnel field-effect transistors; strain-engineered staggered gap; tensile-strained H-TFET; tunneling barrier; Heterojunctions; Indium gallium arsenide; Performance evaluation; Photonic band gap; Semiconductor process modeling; Strain; Tunneling; Ge/InGaAs heterojunctions; InGaAs; strained Ge; tunnel FETs (TFETs); tunnel FETs (TFETs).;
Journal_Title :
Electron Devices, IEEE Transactions on
DOI :
10.1109/TED.2015.2469536