DocumentCode :
3605376
Title :
Ultra-High Bit Density 3D NAND Flash-Featuring-Assisted Gate Operation
Author :
Yi-Hsuan Hsiao ; Hang-Ting Lue ; Wei-Chen Chen ; Bing-Yue Tsui ; Kuang-Yeu Hsieh ; Chih-Yuan Lu
Author_Institution :
Macronix Int. Co., Ltd., Hsinchu, Taiwan
Volume :
36
Issue :
10
fYear :
2015
Firstpage :
1015
Lastpage :
1017
Abstract :
Lower saturation current flowing through the same cell twice is a major drawback of vertical stack array transistor architecture. A loading effect further reduces the saturation current and causes higher threshold voltage. A simple word line cut process not only doubles the bit density to reduce the bit cost, but also reduces the loading effect. This letter used an assisted gate can to further enhance the saturation current with acceptable cell characteristics. Furthermore, the major parameters that influence the performance of the vertical stack array transistor architecture were studied extensively. An ultra-high density three-dimensional NAND flash architecture can be used in the future NAND flash industry.
Keywords :
flash memories; integrated memory circuits; three-dimensional integrated circuits; assisted gate operation; bit cost reduction; bit density doubling; loading effect reduction; saturation current enhancement; ultrahigh bit density 3D NAND flash; word line cut process; Arrays; Flash memories; Loading; Logic gates; Microprocessors; Three-dimensional displays; Assisted Gate; Assisted gate; VSAT; WL Cut; WL cut; assisted gate; loading effect; three-dimensional (3D) NAND flash;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/LED.2015.2468723
Filename :
7239557
Link To Document :
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