DocumentCode
3605432
Title
The Piezoresistive Effect of SiC for MEMS Sensors at High Temperatures: A Review
Author
Hoang-Phuong Phan ; Dao, Dzung Viet ; Nakamura, Koichi ; Dimitrijev, Sima ; Nam-Trung Nguyen
Author_Institution
Queensland Micro- & Nanotechnol. Centre, Griffith Univ., Griffith, NSW, Australia
Volume
24
Issue
6
fYear
2015
Firstpage
1663
Lastpage
1677
Abstract
Silicon carbide (SiC) is one of the most promising materials for applications in harsh environments thanks to its excellent electrical, mechanical, and chemical properties. The piezoresistive effect of SiC has recently attracted a great deal of interest for sensing devices in hostile conditions. This paper reviews the piezoresistive effect of SiC for mechanical sensors used at elevated temperatures. We present experimental results of the gauge factors obtained for various poly-types of SiC films and SiC nanowires, the related theoretical analysis, and an overview on the development of SiC piezoresistive transducers. The review also discusses the current issues and the potential applications of the piezoresistive effect in SiC.
Keywords
microsensors; nanowires; piezoresistive devices; semiconductor thin films; silicon compounds; transducers; wide band gap semiconductors; MEMS sensors; SiC; SiC films; SiC nanowires; SiC piezoresistive transducers; chemical properties; electrical properties; gauge factors; harsh environments; high temperatures; mechanical properties; mechanical sensors; piezoresistive effect; silicon carbide; Micromechanical devices; Piezoresistance; Silicon; Silicon carbide; Temperature; Temperature sensors; Silicon carbide; harsh environments; microelectromechanical systems (MEMS); microelectromechanical systems (MEMS).; piezoresistance; piezoresistive effect;
fLanguage
English
Journal_Title
Microelectromechanical Systems, Journal of
Publisher
ieee
ISSN
1057-7157
Type
jour
DOI
10.1109/JMEMS.2015.2470132
Filename
7243309
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