• DocumentCode
    3606567
  • Title

    Fast Structure-Aware Direct Time-Domain Finite-Element Solver for the Analysis of Large-Scale On-Chip Circuits

  • Author

    Woochan Lee ; Dan Jiao

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA
  • Volume
    5
  • Issue
    10
  • fYear
    2015
  • Firstpage
    1477
  • Lastpage
    1487
  • Abstract
    A fast time-domain finite-element algorithm is developed for the analysis and the design of very large-scale on-chip circuits. The structure specialty of on-chip circuits, such as Manhattan geometry and layered permittivity, is preserved in the proposed algorithm. As a result, the large-scale matrix solution encountered in the 3-D circuit analysis is turned into a simple scaling of the solution of a small 1-D tridiagonal matrix, which can be obtained in linear (optimal) complexity with negligible cost. Furthermore, the time step size is not sacrificed, and the total number of time steps to be simulated is also significantly reduced, thus achieving a total cost reduction in the CPU time. Applications to the simulation of very large-scale on-chip circuit structures on a single core have demonstrated the superior performance of the proposed method.
  • Keywords
    VLSI; finite element analysis; network analysis; 1D tridiagonal matrix; 3D circuit analysis; Manhattan geometry; fast time domain finite element algorithm; layered permittivity; linear complexity; structure aware direct time domain finite element solver; very large scale on-chip circuits; Conductivity; Conductors; Dielectrics; Eigenvalues and eigenfunctions; Permittivity; System-on-chip; Time-domain analysis; DC analysis; fast solvers; on-chip circuits; on-die power grids; time-domain finite-element method (TDFEM); transient analysis; transient analysis.;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    2156-3950
  • Type

    jour

  • DOI
    10.1109/TCPMT.2015.2472403
  • Filename
    7273868