DocumentCode
3606567
Title
Fast Structure-Aware Direct Time-Domain Finite-Element Solver for the Analysis of Large-Scale On-Chip Circuits
Author
Woochan Lee ; Dan Jiao
Author_Institution
Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA
Volume
5
Issue
10
fYear
2015
Firstpage
1477
Lastpage
1487
Abstract
A fast time-domain finite-element algorithm is developed for the analysis and the design of very large-scale on-chip circuits. The structure specialty of on-chip circuits, such as Manhattan geometry and layered permittivity, is preserved in the proposed algorithm. As a result, the large-scale matrix solution encountered in the 3-D circuit analysis is turned into a simple scaling of the solution of a small 1-D tridiagonal matrix, which can be obtained in linear (optimal) complexity with negligible cost. Furthermore, the time step size is not sacrificed, and the total number of time steps to be simulated is also significantly reduced, thus achieving a total cost reduction in the CPU time. Applications to the simulation of very large-scale on-chip circuit structures on a single core have demonstrated the superior performance of the proposed method.
Keywords
VLSI; finite element analysis; network analysis; 1D tridiagonal matrix; 3D circuit analysis; Manhattan geometry; fast time domain finite element algorithm; layered permittivity; linear complexity; structure aware direct time domain finite element solver; very large scale on-chip circuits; Conductivity; Conductors; Dielectrics; Eigenvalues and eigenfunctions; Permittivity; System-on-chip; Time-domain analysis; DC analysis; fast solvers; on-chip circuits; on-die power grids; time-domain finite-element method (TDFEM); transient analysis; transient analysis.;
fLanguage
English
Journal_Title
Components, Packaging and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
2156-3950
Type
jour
DOI
10.1109/TCPMT.2015.2472403
Filename
7273868
Link To Document