Title :
Multiscale statistically correlated variability: A unified model for computer-aided design
Author :
Poiroux, T. ; Scheer, P. ; Juge, A. ; Vinet, M.
Author_Institution :
Leti, CEA, Grenoble, France
Abstract :
A simple analytical model of statistically correlated variability that unifies local and global variations is presented. This model is compatible with computer-aided design (CAD) implementation, and covers device dimension-dependent mismatch, distance-dependent mismatch, and statistical across-chip variations in a single formulation. It is able to describe the effect of correlated variability sources at all scales, including the case where variability source features components with correlation lengths of the order of magnitude of typical device dimensions. This approach generalizes Pelgrom´s analysis and can be easily implemented in CAD tools for Monte Carlo simulations of multiscale variability.
Keywords :
Monte Carlo methods; statistical analysis; technology CAD (electronics); CAD; Monte Carlo simulation; Pelgrom analysis; computer-aided design; dimension-dependent mismatch; distance-dependent mismatch; multiscale statistically correlated variability; statistical across-chip variation; unified model; Analytical models; Correlation; Design automation; Fourier transforms; Integrated circuit modeling; Solid modeling; Standards; Across-chip variation modeling; IC modeling; SPICE; SPICE.; analytical models; local and global variability modeling; mismatch modeling; process variations;
Journal_Title :
Electron Devices, IEEE Transactions on
DOI :
10.1109/TED.2015.2478912
