Title :
Multidimensional Variability Analysis of Complex Power Distribution Networks via Scalable Stochastic Collocation Approach
Author :
Prasad, Aditi Krishna ; Roy, Sourajeet
Author_Institution :
Dept. of Electr. & Comput. Eng., Colorado State Univ., Fort Collins, CO, USA
Abstract :
This paper presents a novel SPICE-compatible stochastic collocation approach for the variability analysis of complex and irregular-shaped power distribution networks (PDNs). The proposed methodology relies on the Stroud cubature rules for locating the sparse set of collocation nodes within the multidimensional random space where the deterministic SPICE simulation of the PDN needs to be performed. The key advantage of the proposed Stroud cubature approach is that the number of collocation nodes required scales linearly with the number of random dimensions as opposed to the exponential or polynomial scaling exhibited by the conventional nonintrusive polynomial chaos approaches, thereby resulting in significantly faster simulations. The validity of the proposed approach for both single-layered and multilayered PDNs characterized by holes/apertures, narrow slots, and irregular geometries is established through multiple numerical examples.
Keywords :
VLSI; chaos; integrated circuit interconnections; integrated circuit modelling; polynomials; stochastic processes; SPICE simulation; SPICE-compatible stochastic collocation approach; Stroud cubature rules; collocation nodes; complex power distribution networks; exponential scaling; irregular-shaped power distribution networks; multidimensional random space; multidimensional variability analysis; multilayered PDN; nonintrusive polynomial chaos approaches; polynomial scaling; scalable stochastic collocation approach; single-layered PDN; Integrated circuit modeling; Numerical models; Periodic structures; Polynomials; Power transmission lines; SPICE; Stochastic processes; Cubature rules; multiconductor transmission lines (MTLs); polynomial chaos; power integrity; statistical moments; stochastic collocation (SC); variability analysis; variability analysis.;
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
DOI :
10.1109/TCPMT.2015.2477717