• DocumentCode
    3607966
  • Title

    Multidimensional Variability Analysis of Complex Power Distribution Networks via Scalable Stochastic Collocation Approach

  • Author

    Prasad, Aditi Krishna ; Roy, Sourajeet

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Colorado State Univ., Fort Collins, CO, USA
  • Volume
    5
  • Issue
    11
  • fYear
    2015
  • Firstpage
    1656
  • Lastpage
    1668
  • Abstract
    This paper presents a novel SPICE-compatible stochastic collocation approach for the variability analysis of complex and irregular-shaped power distribution networks (PDNs). The proposed methodology relies on the Stroud cubature rules for locating the sparse set of collocation nodes within the multidimensional random space where the deterministic SPICE simulation of the PDN needs to be performed. The key advantage of the proposed Stroud cubature approach is that the number of collocation nodes required scales linearly with the number of random dimensions as opposed to the exponential or polynomial scaling exhibited by the conventional nonintrusive polynomial chaos approaches, thereby resulting in significantly faster simulations. The validity of the proposed approach for both single-layered and multilayered PDNs characterized by holes/apertures, narrow slots, and irregular geometries is established through multiple numerical examples.
  • Keywords
    VLSI; chaos; integrated circuit interconnections; integrated circuit modelling; polynomials; stochastic processes; SPICE simulation; SPICE-compatible stochastic collocation approach; Stroud cubature rules; collocation nodes; complex power distribution networks; exponential scaling; irregular-shaped power distribution networks; multidimensional random space; multidimensional variability analysis; multilayered PDN; nonintrusive polynomial chaos approaches; polynomial scaling; scalable stochastic collocation approach; single-layered PDN; Integrated circuit modeling; Numerical models; Periodic structures; Polynomials; Power transmission lines; SPICE; Stochastic processes; Cubature rules; multiconductor transmission lines (MTLs); polynomial chaos; power integrity; statistical moments; stochastic collocation (SC); variability analysis; variability analysis.;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    2156-3950
  • Type

    jour

  • DOI
    10.1109/TCPMT.2015.2477717
  • Filename
    7294669