• DocumentCode
    3608239
  • Title

    Investigation Into the Quality Factor of Piezoelectric-on-Silica Micromachined Resonators

  • Author

    Peczalski, Adam ; Zhengzheng Wu ; Tabrizian, Roozbeh ; Rais-Zadeh, Mina

  • Author_Institution
    Univ. of Michigan, Ann Arbor, MI, USA
  • Volume
    24
  • Issue
    6
  • fYear
    2015
  • Firstpage
    1695
  • Lastpage
    1702
  • Abstract
    In this paper, we investigate loss mechanisms in piezoelectric-on-silica bulk acoustic wave resonators, including those resulting from thermoelastic damping (TED), surface roughness, and supporting tethers. Alternate resonator designs, piezoelectric materials, and fabrication processes are demonstrated to empirically test these loss mechanisms. Quality factors (Qs) in the order of ~16000 at a center frequency of 5 MHz have been consistently measured for aluminum nitride (AlN)-on-silica coupled-ring resonators. It is shown that neither TED nor surface losses are the dominant sources of loss for AlN-on-silica resonators in the megahertz regime. Instead, it is suggested that charge redistribution loss resulting from nonuniform strain across the piezoelectric layer is the dominant loss mechanism, with a charge redistribution Q of ~38000 at 5 MHz for AlN-on-silica devices. When all loss mechanisms are considered, the total Q is estimated to be 25000, a value comparable to the measured results of the piezoelectric-on-silica resonators of this paper.
  • Keywords
    aluminium compounds; bulk acoustic wave devices; micromechanical resonators; piezoelectric materials; silicon compounds; surface roughness; thermoelasticity; AlN-SiO2; AlN-on-silica coupled-ring resonators; alternate resonator designs; aluminum nitride; bulk acoustic wave resonators; fabrication process; frequency 5 MHz; loss mechanisms; piezoelectric layer; piezoelectric materials; piezoelectric-on-silica micromachined resonators; quality factor; supporting tethers; surface roughness; thermoelastic damping; Aluminum nitride; Couplings; Fabrication; Micromechanical devices; Optical resonators; Performance evaluation; Silicon compounds; MEMS; aluminum nitride; charge redistribution; fused silica; fused silica.; resonator; surface loss; thermoelastic damping;
  • fLanguage
    English
  • Journal_Title
    Microelectromechanical Systems, Journal of
  • Publisher
    ieee
  • ISSN
    1057-7157
  • Type

    jour

  • DOI
    10.1109/JMEMS.2015.2481362
  • Filename
    7297799