• DocumentCode
    3608323
  • Title

    Cox-Proportional Hazards Modeling in Reliability Analysis—A Study of Electromagnetic Relays Data

  • Author

    Lingling Li ; Dongjuan Ma ; Zhigang Li

  • Author_Institution
    Province-Minist. Joi nt Key Lab. of Electromagn. Field & Electr. Apparatus Reliability, Hebei Univ. of Technol., Tianjin, China
  • Volume
    5
  • Issue
    11
  • fYear
    2015
  • Firstpage
    1582
  • Lastpage
    1589
  • Abstract
    Ambient temperature is an important factor influencing the reliability of electromagnetic relays. The effect of different environmental temperatures on relay lifetime can be examined through the Cox-proportional hazards model (PHM). In this paper, relay life tests were carried out at -20 °C, 20 °C, and 55 °C. Relay lifetime data were collected at various temperature conditions and were integrated to establish a Weibull PHM of electromagnetic relays. A comparative analysis of the experimental data indicates that an ambient temperature has a significant influence on contact resistance. The characteristic life, the mean life, and the probability density function of failure under temperature conditions not tested in the conducted experiment were estimated through the implementation of Cox PHM. Both the characteristic life and mean life decrease significantly with increasing ambient temperature. The perspectives and the methodology of the implementation of the Weibull PHM presented in this paper are generic and could be adopted for other systems/products directly.
  • Keywords
    Weibull distribution; probability; relays; reliability; Weibull PHM; characteristic life; cox-proportional hazards modeling; electromagnetic relays data; mean life; probability density function; relay lifetime; temperature -20 degC; temperature 20 degC; temperature 55 degC; Contact resistance; Electromagnetics; Prognostics and health management; Relays; Reliability; Stress; Temperature; Electromagnetic relays; Weibull distribution; Weibull distribution.; lifetime; proportional hazards model (PHM); testing temperature;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    2156-3950
  • Type

    jour

  • DOI
    10.1109/TCPMT.2015.2480229
  • Filename
    7298432