Complete 3D-Reduced Surface Field Superjunction Lateral Double-Diffused MOSFET Breaking Silicon Limit

A new superjunction lateral double-diffused MOS with the semi-insulating poly silicon (SIPOS SJ-LDMOS) has been proposed in this letter, for the first time, with the complete three-dimensional reduced surface field (3D-RESURF). The SIPOS SJ-LDMOS along the three dimensions are subject to the electric field modulation, which achieves the complete 3D-RESURF effect. The simulated breakdown voltage (BV) for the unit length of the drift region is improved to 19.4 V/μm. The drift region with the high concentration compared with the conventional LDMOS can be depleted completely in the OFF-state to obtain the high BV. Moreover, the majority carrier accumulation can be formed to further decrease R_ON,sp (specific on resistance) during the ON-state operation. Three effects have been combined to SIPOS SJ-LDMOS for the superjunction ideal, electric field modulation and the majority carrier accumulation by SIPOS. The tradeoff between the BV and R_ON,sp has been improved to break through the silicon limit. The results show that the experimental R_ON,sp of SIPOS SJ-LDMOS is 18 mQ · cm² with the tested BV of 376 V, which is less than that of 31.1 mQ · cm² for the N-buffer SJ-LDMOS with the simulated BV of 287 V, and far less than 71.8 mQ · cm² for the conventional LDMOS with the simulated BV of 254 V for the same drift region length of 20 μm.