• DocumentCode
    3609104
  • Title

    FinFET Evolution Toward Stacked-Nanowire FET for CMOS Technology Scaling

  • Author

    Peng Zheng ; Connelly, Daniel ; Fei Ding ; Tsu-Jae King Liu

  • Author_Institution
    Dept. of Electr. Eng. & Comput. Sci., Univ. of California at Berkeley, Berkeley, CA, USA
  • Volume
    62
  • Issue
    12
  • fYear
    2015
  • Firstpage
    3945
  • Lastpage
    3950
  • Abstract
    The performance of an evolutionary FinFET design (iFinFET) is benchmarked against that of the conventional bulk FinFET and stacked-nanowire gate-all-around (GAA) FET, through3-D device simulations, for both n-channel and p-channel transistors. The results show that the iFinFET provides for improved electrostatic integrity relative to the FinFET, but with substantially less gate capacitance penalty relative to the GAA FET. Thus, iFinFET technology offers a technological pathway for continued transistor scaling with performance improvement, for future low-power system-on-chip applications.
  • Keywords
    CMOS integrated circuits; MOSFET; nanowires; CMOS technology scaling; FinFET evolution; electrostatic integrity; gate-all-around FET; n-channel transistors; p-channel transistors; stacked-nanowire FET; transistor scaling; CMOS technology; FinFETs; Nanowires; System-on-chip; CMOS technology; FinFET; gate-all-around (GAA) FET; inserted-oxide FinFET (iFinFET); system-on-chip (SoC); system-on-chip (SoC).;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2015.2487367
  • Filename
    7308053