• DocumentCode
    3609562
  • Title

    Wet/dry etching combined microtextured structures for high-efficiency solar cells

  • Author

    Chan Seob Cho ; DaeYoung Kong ; Bonghwan Kim

  • Author_Institution
    Sch. of Electron. Eng., Kyungpook Nat. Univ., Daegu, South Korea
  • Volume
    10
  • Issue
    10
  • fYear
    2015
  • Firstpage
    528
  • Lastpage
    532
  • Abstract
    A solar cell texturing process using a two-step process that includes wet etching and dry etching has been developed. The surface reflectance and fill factor (FF) of the pyramid structure by general wet etching texturing process were 5.834 and 70.597%, respectively; the surface reflectance and FF of the two-step pyramid structure by wet etching and dry etching texturing process were 3.69 and 65.013%; and the surface reflectance and FF of the two-step pyramid structure by rounded pyramid and dry etching texturing process were 4.533 and 70.727%. The process of the two-step pyramid structure is as follows. First, the pyramid structure formed by the wet etching process was etched again with tetramethylammonium hydroxide solution. Then, the crest and the trough of the pyramid structure was fine etched, and rounded pyramid structures with a uniform n+ layer was formed. Secondly, a pyramid structure with a high angle on the rounded pyramid structure was formed by using reactive-ion etching with a metal mesh. The two-step pyramid structure by the wet etching and dry etching texturing process has a lower surface reflectance and higher FF than the pyramid structure formed of the wet etching texturing process. Therefore, the etching process is suitable for producing high-efficiency solar cells.
  • Keywords
    etching; organic compounds; solar cells; surface texture; dry etching; fill factor; high-efficiency solar cells; metal mesh; microtextured structures; pyramid structure; reactive-ion etching; solar cell texturing process; surface reflectance; two-step process; wet etching;
  • fLanguage
    English
  • Journal_Title
    Micro Nano Letters, IET
  • Publisher
    iet
  • ISSN
    1750-0443
  • Type

    jour

  • DOI
    10.1049/mnl.2015.0182
  • Filename
    7312574