DocumentCode :
3609708
Title :
Quantifying the Impact of FEXT on Eye Margin for Coupled Lines in Inhomogeneous Media
Author :
Chada, Arun ; Mutnury, Bhyrav ; Jun Fan ; Drewniak, James L.
Author_Institution :
Enterprise Server Simulation Group, DELL, Round Rock, TX, USA
Volume :
57
Issue :
6
fYear :
2015
Firstpage :
1665
Lastpage :
1675
Abstract :
Increase in printed circuit board costs is leading to denser routing of high-speed signal traces and to the use of low-cost dielectric materials for high-volume manufacturing. This, in turn, is increasing crosstalk among the traces. The crosstalk between the coupled traces in adjacent layers and the same layers is becoming an important factor to take into account as the signal speed increases. The dielectric media in the vertical stackup may not be homogeneous, and this increases the far-end crosstalk (FEXT) and insertion loss (THRU); thereby, reducing the signal to noise ratio of the high-speed link. This paper investigates the FEXT crosstalk impact on eye opening at a specified bit error rate at different signal speeds for differential coupled traces in inhomogeneous media and compares the results against homogeneous media models. A set of design guidelines regarding the material, coupled length, and stackup parameter selection is formulated for designers based on the signaling speeds.
Keywords :
crosstalk; dielectric materials; error statistics; inhomogeneous media; network routing; printed circuit manufacture; FEXT crosstalk; bit error rate; coupled lines; dielectric media; differential coupled traces; eye margin; far-end crosstalk; high-speed signal traces; high-volume manufacturing; homogeneous media models; inhomogeneous media; insertion loss; low-cost dielectric materials; printed circuit board costs; signal speed; signal to noise ratio; Conductors; Couplings; Crosstalk; Geometry; Nonhomogeneous media; Transmission line matrix methods; Bit error rate (BER); broadside coupling; crosstalk; far-end crosstalk (FEXT); inhomogeneous media; insertion loss (THRU);
fLanguage :
English
Journal_Title :
Electromagnetic Compatibility, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9375
Type :
jour
DOI :
10.1109/TEMC.2015.2476696
Filename :
7317526
Link To Document :
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