DocumentCode :
3609976
Title :
Dovetail Tip: A New Approach for Low-Threshold Vacuum Nanoelectronics
Author :
Pennisi, Salvatore ; Castorina, Giovanni ; Patti, Davide
Author_Institution :
Dipt. di Ing. Elettr. Elettron. e Inf., Univ. of Catania, Catania, Italy
Volume :
62
Issue :
12
fYear :
2015
Firstpage :
4293
Lastpage :
4300
Abstract :
An innovative approach for the fabrication of low-threshold, nanoscale field-emitter cathodes and arrays is proposed. By shaping a titanium cathode as dovetail geometry and using a thin vertical wall of high-permittivity dielectric, Si3N4, to isolate the tip from the gate, the electric field intensity near the tip edges is strongly increased, and a turn-ON voltage in the range of a few volts is predicted numerically and observed experimentally. The resulting cathode structure is compact, self-aligned to the vacuum cavity and is fabricated through the standard silicon fabrication processes. Besides, unlike all existing approaches, vacuum is achieved at the wafer level and not at the package level, thereby reducing fabrication costs. Measurements on a first prototyped array of 5×4 diode-connected parallel devices with a silicon area of 5 μm×4 μm, confirm Fowler-Nordheim emission with a 2 V turn-ON voltage, while displaying a total emission current of 25 μA at a gate-cathode bias of 20 V.
Keywords :
cathodes; elemental semiconductors; field emitter arrays; nanoelectronics; permittivity; semiconductor diodes; silicon; silicon compounds; Fowler-Nordheim emission; Si; Si3N4; current 25 muA; diode-connected parallel devices; dovetail geometry; dovetail tip; electric field intensity; high-permittivity dielectric; low-threshold arrays; low-threshold cathodes; low-threshold vacuum nanoelectronics; nanoscale field-emitter arrays; nanoscale field-emitter cathodes; silicon fabrication; thin vertical wall; titanium cathode; vacuum cavity; wafer level; Cathodes; Dielectrics; Fabrication; Nanoelectronics; Vacuum electronics; Very large scale integration; Cold cathode; Fowler-Nordheim; Fowler???Nordheim; vacuum; very large scale integration; very large scale integration.;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2015.2493440
Filename :
7322208
Link To Document :
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