DocumentCode
3611860
Title
Investigating Pulsed X-ray Induced SEE in Analog Microelectronic Devices
Author
Cardoza, David ; LaLumondiere, Stephen D. ; Wells, Nathan P. ; Tockstein, Michael A. ; Brewe, Dale L. ; Lotshaw, William T. ; Moss, Steven C.
Author_Institution
Photonics Technol. Dept., Aerosp. Corp., Los Angeles, CA, USA
Volume
62
Issue
6
fYear
2015
Firstpage
2458
Lastpage
2467
Abstract
We investigate analog single event transient (ASET) generation in an LM124 operational amplifier using focused pulsed x-rays and 800 nm femtosecond laser pulses. We report improvements that have been made to the pulsed x-ray experimental apparatus which include normal incidence geometry and a high speed x-ray chopper that allows us to reduce the pulse repetition frequency of the synchrotron derived x-ray pulse train. The addition of the chopper allows us to measure ASETs that have long relaxation times. We show that ASETs can be generated through metallization on the LM124, and that for equivalent pulse energy incident on the part, the x-ray response from areas covered by metal (and inaccessible to the laser) are different than the x-ray response from areas with no metallization, i.e. “metal-free”. We use the laser pulses to generate ASETs at the same metal-free locations of x-ray induced ASETs. The shapes of the ASETs generated by the two methods are compared. We use the differences seen from the two generation methods to estimate the charge generation/collection produced by the pulsed x-rays and then estimate what LET this would correspond to for heavy ions. This work shows that pulsed x-rays can be used to characterize analog devices for single event effects.
Keywords
operational amplifiers; radiation hardening (electronics); semiconductor device reliability; analog microelectronic devices; analog single event transient generation; charge collection; charge generation; focused pulsed x-rays; operational amplifier; pulsed X-ray induced SEE; single event effects; Integrated circuit reliability; Radiation hardening (electronics); Semiconductor device reliability; Single event transients; X-ray applications; Integrated circuit reliability; radiation hardening; semiconductor device reliability; single event effects; single event transients; synchrotron radiation; x-ray applications;
fLanguage
English
Journal_Title
Nuclear Science, IEEE Transactions on
Publisher
ieee
ISSN
0018-9499
Type
jour
DOI
10.1109/TNS.2015.2498100
Filename
7348753
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