• DocumentCode
    3611860
  • Title

    Investigating Pulsed X-ray Induced SEE in Analog Microelectronic Devices

  • Author

    Cardoza, David ; LaLumondiere, Stephen D. ; Wells, Nathan P. ; Tockstein, Michael A. ; Brewe, Dale L. ; Lotshaw, William T. ; Moss, Steven C.

  • Author_Institution
    Photonics Technol. Dept., Aerosp. Corp., Los Angeles, CA, USA
  • Volume
    62
  • Issue
    6
  • fYear
    2015
  • Firstpage
    2458
  • Lastpage
    2467
  • Abstract
    We investigate analog single event transient (ASET) generation in an LM124 operational amplifier using focused pulsed x-rays and 800 nm femtosecond laser pulses. We report improvements that have been made to the pulsed x-ray experimental apparatus which include normal incidence geometry and a high speed x-ray chopper that allows us to reduce the pulse repetition frequency of the synchrotron derived x-ray pulse train. The addition of the chopper allows us to measure ASETs that have long relaxation times. We show that ASETs can be generated through metallization on the LM124, and that for equivalent pulse energy incident on the part, the x-ray response from areas covered by metal (and inaccessible to the laser) are different than the x-ray response from areas with no metallization, i.e. “metal-free”. We use the laser pulses to generate ASETs at the same metal-free locations of x-ray induced ASETs. The shapes of the ASETs generated by the two methods are compared. We use the differences seen from the two generation methods to estimate the charge generation/collection produced by the pulsed x-rays and then estimate what LET this would correspond to for heavy ions. This work shows that pulsed x-rays can be used to characterize analog devices for single event effects.
  • Keywords
    operational amplifiers; radiation hardening (electronics); semiconductor device reliability; analog microelectronic devices; analog single event transient generation; charge collection; charge generation; focused pulsed x-rays; operational amplifier; pulsed X-ray induced SEE; single event effects; Integrated circuit reliability; Radiation hardening (electronics); Semiconductor device reliability; Single event transients; X-ray applications; Integrated circuit reliability; radiation hardening; semiconductor device reliability; single event effects; single event transients; synchrotron radiation; x-ray applications;
  • fLanguage
    English
  • Journal_Title
    Nuclear Science, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9499
  • Type

    jour

  • DOI
    10.1109/TNS.2015.2498100
  • Filename
    7348753