Title :
Low temperature flip-chip process using ICA and NCA (isotropically and non-conductive adhesive) for flexible displays application
Author :
J. Vanfleteren;B. Vandecasteele;T. Podprocky
Author_Institution :
Imec/Intec/TFCG, Gent, Belgium
fDate :
6/24/1905 12:00:00 AM
Abstract :
The paper investigates the possibilities to flip-chip assemble Si driver chips onto a flexible display, which is to be integrated in a smart card. The chips are Ni/Au bumped, the substrate material consists of PES (polyether sulphone) with conductive ITO pads. An original technology, using ICA and NCA was proven to be applicable in a quite straightforward way with measured contact resistances below 5/spl Omega/.
Keywords :
"Temperature","Independent component analysis","Nonconductive adhesives","Displays","Assembly","Smart cards","Gold","Conducting materials","Indium tin oxide","Electrical resistance measurement"
Conference_Titel :
Electronics Packaging Technology Conference, 2002. 4th
Print_ISBN :
0-7803-7435-5
DOI :
10.1109/EPTC.2002.1185656
