Title :
Some aspects of lead free soldering
Author :
J. Stary;I. Szendiuch
Author_Institution :
Fac. of Electr. Eng. & Commun. Technol., Brno Univ. of Technol., Czech Republic
fDate :
6/25/1905 12:00:00 AM
Abstract :
Lead free soldering implementation process needs some knowledge´s about materials and process compatibility in different industrial conditions. Material selection for soldering process has to be compatible for having the best results in wetting characteristics, solder joint formation, and final solder joint reliability. Material compatibility includes selection type of fluxes, air/nitrogen atmosphere, solders alloy compositions, surface treatments of components and PCBs and optimized soldering process settings.
Keywords :
"Environmentally friendly manufacturing techniques","Lead","Soldering","Surface morphology","Copper alloys","Temperature distribution","Inorganic materials","Tin alloys","Computational Intelligence Society","Atmosphere"
Conference_Titel :
Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on
Print_ISBN :
0-7803-8002-9
DOI :
10.1109/ISSE.2003.1260510
