Title :
Thermal shock reliability tests of multilayer LTCC modules with thick film conductors
Author :
A. Pietrikova;J. Bansky;M. Bujalobokova;J. Urbancik
Author_Institution :
Dept. of Technol. in Electron., Kosice Tech. Univ., Slovakia
fDate :
6/25/1905 12:00:00 AM
Abstract :
This paper deals with bent modules based on LTCC (low temperature cofired ceramic) for electronics related to reliability and of thermal cyclic stress stability in the temperature range from -40/spl deg/C to +125/spl deg/C. The interpretation of the thermal shock influence on electrical parameters of built-in conductive paths at bent multilayer LTCC modules refers to the fatigue of thick film conductors and ceramic materials as well as on failure and broken down initiator.
Keywords :
"Thermal conductivity","Electric shock","Testing","Nonhomogeneous media","Thick films","Conductive films","Temperature distribution","Ceramics","Thermal stresses","Conducting materials"
Conference_Titel :
Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on
Print_ISBN :
0-7803-8002-9
DOI :
10.1109/ISSE.2003.1260578
