DocumentCode
3618396
Title
Overview of physics of stress-induced voiding in microelectronics metallizations
Author
T.d. Sullivan
fYear
2004
fDate
6/26/1905 12:00:00 AM
Firstpage
198
Lastpage
198
Keywords
"Physics","Microelectronics","Metallization","Niobium compounds","Titanium compounds","Artificial intelligence","Thermal stresses","Circuits","Degradation"
Publisher
ieee
Conference_Titel
Integrated Reliability Workshop Final Report, 2004 IEEE International
Print_ISBN
0-7803-8517-9
Type
conf
DOI
10.1109/IRWS.2004.1422782
Filename
1422782
Link To Document