• DocumentCode
    3618864
  • Title

    Development of Low Stress No-Flow Underfill for Flip-Chip Application

  • Author

    O. Suzuki;S. Kawamoto

  • fYear
    2005
  • fDate
    6/27/1905 12:00:00 AM
  • Firstpage
    185
  • Lastpage
    189
  • Keywords
    "Packaging","Lead","Environmentally friendly manufacturing techniques","Assembly","Thermal expansion","Flip chip","Resins","Thermal stresses","Testing","Curing"
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2005. Proceedings. 55th
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-8907-7
  • Electronic_ISBN
    2377-5726
  • Type

    conf

  • DOI
    10.1109/ECTC.2005.1441265
  • Filename
    1441265
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3618864