3618864

Development of Low Stress No-Flow Underfill for Flip-Chip Application

O. Suzuki;S. Kawamoto

2005

6/27/1905 12:00:00 AM

185

189

"Packaging","Lead","Environmentally friendly manufacturing techniques","Assembly","Thermal expansion","Flip chip","Resins","Thermal stresses","Testing","Curing"

ieee

Electronic Components and Technology Conference, 2005. Proceedings. 55th

0569-5503

0-7803-8907-7

2377-5726

conf

10.1109/ECTC.2005.1441265

1441265