Mechanical cycling in accelerated life - time tests of lead - free soldered joints

Typical accelerated life-time tests of soldered joints are temperature cycling and thermal shock cycling. In last time other, more economical and effective methods are searched. In Warsaw University of Technology was developed the mechanical cycling method and appropriate test stand. The test samples of printed circuits with soldered components are bent with constant radius at all length of the printed circuit. The new method seems to be perspective, especially for small producers of electronic equipment, because of low costs and short test time. FEM analysis and first tests showed that new method can be useful, especially by testing of lead-free technology, implemented according to ROHS Directive of European Community