3619272

Temperature field simulation of thick-film microcircuits using finite element method

G. Bad;W. Kalita;D. Klepacki;F. Rozak;M. Weglarski

2005

6/27/1905 12:00:00 AM

140

143

"Finite element methods","Heat transfer","Differential equations","Boundary conditions","Nonlinear equations","Mathematical analysis","Temperature distribution","Circuit simulation","Finite difference methods","Boundary element methods"

ieee

Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2005. 28th International Spring Seminar on

0-7803-9325-2

conf

10.1109/ISSE.2005.1491015

1491015