• DocumentCode
    3619469
  • Title

    Influence of CMOS-circuit areas on RF-damping of gold and aluminium microstripline in combined SIMMWIC-CMOS technology

  • Author

    D. Beck;E. Kasper

  • Author_Institution
    University of Stuttgart, Germany
  • fYear
    1997
  • fDate
    6/19/1905 12:00:00 AM
  • Firstpage
    732
  • Lastpage
    735
  • Keywords
    "Gold","Aluminum","Microstrip","CMOS technology","Circuits","Silicon","Damping","Dielectric substrates","Frequency","Conductivity"
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Device Research Conference, 1997. Proceeding of the 27th European
  • Print_ISBN
    2-86332-221-4
  • Type

    conf

  • DOI
    10.1109/ESSDERC.1997.194533
  • Filename
    1503463