DocumentCode
3619469
Title
Influence of CMOS-circuit areas on RF-damping of gold and aluminium microstripline in combined SIMMWIC-CMOS technology
Author
D. Beck;E. Kasper
Author_Institution
University of Stuttgart, Germany
fYear
1997
fDate
6/19/1905 12:00:00 AM
Firstpage
732
Lastpage
735
Keywords
"Gold","Aluminum","Microstrip","CMOS technology","Circuits","Silicon","Damping","Dielectric substrates","Frequency","Conductivity"
Publisher
ieee
Conference_Titel
Solid-State Device Research Conference, 1997. Proceeding of the 27th European
Print_ISBN
2-86332-221-4
Type
conf
DOI
10.1109/ESSDERC.1997.194533
Filename
1503463
Link To Document