DocumentCode :
3619469
Title :
Influence of CMOS-circuit areas on RF-damping of gold and aluminium microstripline in combined SIMMWIC-CMOS technology
Author :
D. Beck;E. Kasper
Author_Institution :
University of Stuttgart, Germany
fYear :
1997
fDate :
6/19/1905 12:00:00 AM
Firstpage :
732
Lastpage :
735
Keywords :
"Gold","Aluminum","Microstrip","CMOS technology","Circuits","Silicon","Damping","Dielectric substrates","Frequency","Conductivity"
Publisher :
ieee
Conference_Titel :
Solid-State Device Research Conference, 1997. Proceeding of the 27th European
Print_ISBN :
2-86332-221-4
Type :
conf
DOI :
10.1109/ESSDERC.1997.194533
Filename :
1503463
Link To Document :
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