3619485

Thermal Issues in LDMOSFET Packages

P. Khandelwal;M. Trivedi;K. Shenai

University of Illinois at Chicago, Chicago, IL, United States

1998

6/20/1905 12:00:00 AM

556

559

"Packaging","Radio frequency","Power dissipation","Power generation","Isothermal processes","Degradation","MOSFETs","Temperature dependence","Performance analysis","Heating"

ieee

Solid-State Device Research Conference, 1998. Proceeding of the 28th European

2-86332-234-6

conf

1503612