DocumentCode :
3619912
Title :
Die-on-wafer and wafer-level 3D integration for millimeter-wave smart antenna tranceivers
Author :
M.M. Hella;S. Devarajan;J.-Q. Lu;K. Rose;R.J. Gutmann
fYear :
2005
fDate :
6/27/1905 12:00:00 AM
Firstpage :
21
Lastpage :
21
Keywords :
"Transceivers","Inductors","Silicon germanium","Germanium silicon alloys","BiCMOS integrated circuits","High power amplifiers","Radiofrequency amplifiers","Noise figure","Power amplifiers"
Publisher :
ieee
Conference_Titel :
Wireless and Microwave Technology, 2005. WAMICON 2005. The 2005 IEEE Annual Conference
Print_ISBN :
0-7803-8861-5
Type :
conf
DOI :
10.1109/WAMIC.2005.1528358
Filename :
1528358
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3619912
