DocumentCode :
3619915
Title :
Interaction between metal packages and the enclosed MMICs
Author :
Th. Bolz;B. Neuhaus;A. Beyer
fYear :
2005
fDate :
6/27/1905 12:00:00 AM
Firstpage :
26
Lastpage :
26
Keywords :
"Packaging","MMICs","Impedance","RLC circuits","Admittance","Green´s function methods","Magnetic fields","Magnetic resonance","Resonant frequency","Frequency domain analysis"
Publisher :
ieee
Conference_Titel :
Wireless and Microwave Technology, 2005. WAMICON 2005. The 2005 IEEE Annual Conference
Print_ISBN :
0-7803-8861-5
Type :
conf
DOI :
10.1109/WAMIC.2005.1528363
Filename :
1528363
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3619915
