DocumentCode :
3620630
Title :
CMOS scaling and three-dimensional silicon integration
Author :
P. Jansen;L. Starr
fYear :
2005
fDate :
6/27/1905 12:00:00 AM
Firstpage :
652
Lastpage :
653
Keywords :
"Silicon","Circuits","CMOS technology","Packaging","Paper technology","Crosstalk","Isolation technology","Capacitive sensors","Stress","High performance computing"
Publisher :
ieee
Conference_Titel :
Custom Integrated Circuits Conference, 2005. Proceedings of the IEEE 2005
Print_ISBN :
0-7803-9023-7
Type :
conf
DOI :
10.1109/CICC.2005.1568755
Filename :
1568755
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3620630