• DocumentCode
    3621531
  • Title

    Process technology advanced interconnect technology

  • Author

    V. Wang;G. Beyer

  • fYear
    2005
  • fDate
    6/27/1905 12:00:00 AM
  • Firstpage
    76
  • Lastpage
    76
  • Keywords
    "Paper technology","Copper","National electric code","Reliability engineering","Microelectronics","Metallization","Dielectric materials","Inorganic materials"
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 2005. IEDM Technical Digest. IEEE International
  • Print_ISBN
    0-7803-9268-X
  • Type

    conf

  • DOI
    10.1109/IEDM.2005.1609270
  • Filename
    1609270
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3621531