• DocumentCode
    3621708
  • Title

    Coupling concept in connection with surface preparation

  • Author

    P.S. Kracinska;S. Patela

  • Author_Institution
    Dept. of Electron., Wroclaw Univ. of Technol.
  • fYear
    2005
  • fDate
    6/27/1905 12:00:00 AM
  • Firstpage
    55
  • Lastpage
    59
  • Abstract
    The integration of optical interconnections on a printed circuit board (PCB) is challenging, as it should remain compatible with existing PCB manufacturing technology. This integration level requires compatibility with the established manufacturing and assembly processes of the conventional electrical board technology, which is based on laminated FR4-substrates and making use of well-known placement and assembly techniques. Since printed circuit boards will continue to be the most important components of electronic equipment, still the most critical problem of the integration of optical interconnections in PCB is coupling the light in and out of the optical plate. By reason of that, various principles and interconnection architectures for optical beam routing were investigated.
  • Keywords
    "Optical interconnections","Coupling circuits","Printed circuits","Electronic equipment manufacture","Assembly","Integrated circuit manufacture","Manufacturing processes","Electronic equipment","Optical coupling","Integrated optics"
  • Publisher
    ieee
  • Conference_Titel
    Photonics and Microsystems, 2005. Proceedings of 2005 International Students and Young Scientists Workshop
  • ISSN
    1939-4381
  • Print_ISBN
    0-7803-9160-8
  • Type

    conf

  • DOI
    10.1109/STYSW.2005.1617797
  • Filename
    1617797