DocumentCode
3621708
Title
Coupling concept in connection with surface preparation
Author
P.S. Kracinska;S. Patela
Author_Institution
Dept. of Electron., Wroclaw Univ. of Technol.
fYear
2005
fDate
6/27/1905 12:00:00 AM
Firstpage
55
Lastpage
59
Abstract
The integration of optical interconnections on a printed circuit board (PCB) is challenging, as it should remain compatible with existing PCB manufacturing technology. This integration level requires compatibility with the established manufacturing and assembly processes of the conventional electrical board technology, which is based on laminated FR4-substrates and making use of well-known placement and assembly techniques. Since printed circuit boards will continue to be the most important components of electronic equipment, still the most critical problem of the integration of optical interconnections in PCB is coupling the light in and out of the optical plate. By reason of that, various principles and interconnection architectures for optical beam routing were investigated.
Keywords
"Optical interconnections","Coupling circuits","Printed circuits","Electronic equipment manufacture","Assembly","Integrated circuit manufacture","Manufacturing processes","Electronic equipment","Optical coupling","Integrated optics"
Publisher
ieee
Conference_Titel
Photonics and Microsystems, 2005. Proceedings of 2005 International Students and Young Scientists Workshop
ISSN
1939-4381
Print_ISBN
0-7803-9160-8
Type
conf
DOI
10.1109/STYSW.2005.1617797
Filename
1617797
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